ACG Cooler International Limited

best service for large aluminum heatsink:heat sink calculator &heat sink thermal resistance calculator

For semiconductor devices used in a variety of consumer and industrial electronics, the idea of thermal resistance simplifies the selection of heat sinks. The heat flow between the semiconductor die and ambient air is modeled as a series of resistances to heat flow; there is a resistance from the die to the device case, from the case to the heat sink, and from the heat sink to the ambient. The sum of these resistances is the total thermal resistance from the die to the ambient. Thermal resistance is defined as temperature rise per unit of power, analogous to electrical resistance, and is expressed in units of degrees Celsius per watt (C/W). If the device dissipation in watts is known, and the total thermal resistance is calculated, the temperature rise of the die over ambient can be calculated.

ACG has its best service that we can verify if the big aluminum extrusion is OK for cooling your device.Then we may have some suggestion on the design change.In short,we are to consider using the simple extrusion to cover your thermal request but if this simple product is not capable for it,we will have heatsink module design (heatpipes,fan cooler,liquid cold plate etc) for your choice,you can refer to product list on the website.And please feel free to contact us if you have thermal trouble bothering you.